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Description
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Technology & Capabilities
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1. Product Range
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Rigid PCBs from 2- 24 layers, HDI; Aluminium base
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2. Min. Board Thickness
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2 layer
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4 layer
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6 layer
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8 layer
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10 layer
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min. 0.2 mm
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0.4 mm
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1 mm
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1.2 mm
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1.5 mm
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12 & 14 layer
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16 layer
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18 layer
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20 layer
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22 & 24 layer
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1.6 mm
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1.7 mm
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1.8 mm
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2.2 mm
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2.6 mm
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3. Max. Board Size
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610 x 1200 mm
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4. Base Material
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FR-4 Glass Epoxy laminate, Aluminium base, RCC
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5. Surface Finish Treatment
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Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic)
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6. Major Laminate
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King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others.
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7. Via Holes
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Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH
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8. Copper Foil Thickness
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18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz)
18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz)
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9. Min. Via Size and Type
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Dia. 0.15mm (Finished).
Aspect Ratiao = 12; HDI holes (＜0.10mm)
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10. Min. Line Width & Spacing
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0.75 mm/ 0.10mm ( 3mil/ 4mil)
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11. Min Via Hole Size & Pad
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Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI＜0.10mm via
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12. Impedance I Control Tol.
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+/- 10% ( min. +/- 7 Ohm)
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13. Solder Mask
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Liquid Photo- Image (LPI)
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14. Profiling
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CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering
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15. Capacity
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100 k㎡ output monthly
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Item
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Capability
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Base material
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FR4,High-TG FR4,CEM3,aluminum, High Frequencey frequency(Rogers,Taconic,Aron,PTFE,F4B)
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Layers
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1-4 Layers(Alunimum), 1-32 layers(FR4)
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Copper Thickness
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0.5oz, 1oz, 2oz, 3oz,4oz
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Dielectric Thickness
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0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm
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board Core Thickness
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0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm,
1.5mm, 2.0mm, 3.0mm and 3.2mm |
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Board Thickness
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0.4mm - 4.0mm
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Thickness Tolerance
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+/-10%
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Aluminum Machining
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Drilling, Tapping, Milling, Routing, Die-Punching,
Break-off tab available |
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Min Hole
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0.2 mm
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Min Track Width
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0.2mm (8mil)
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Min Track Gap
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0.2mm (8mil)
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Min SMD Pad Pitch
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0.2mm (8mil)
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Surface Finishing
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HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP
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Solder Mask Color
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Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
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Legend Color
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Black, White etc
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Assembly Types
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Surface mount
Thro-hole Mixed technology (SMT & Thru-hole) Single or double sided placement Conformal coating Shield cover assembly for EMI emission control |
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Parts Procurement
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Full Turnkey
Partial Turnkey Kitted/Consigned |
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Component types
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SMT 01005 or larger
BGA 0.4mm pitch, POP (Package on Package) WLCSP 0.35mm pitch Hard metric connectors Cable & wire |
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SMT Parts Presentation
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Bulk
Cut tape Partial reel Reel Tube Tray |
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Stencils
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Laser-cut stainless steel
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Other Techniques
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Free DFM Review
Box Build Assembly 100% AOI test and X-ray test for BGA IC programming Components cost-down Function test as custom Protection technology |
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Sample Lead time
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Mass production lead time
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Single sided PCB
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1~3 days
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4~7 days
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Double sided PCB
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2~5 days
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7~10 days
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Multilayer PCB
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7~8 days
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10~15 days
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PCB Assembly
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8~15 days
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2~4 weeks
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Delivery time
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3-7 days
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3-7 days
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Package: Anti-static Package with carton
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Our products are sold all over the world, you can rest assured.
