Layers | 1-58 layers |
Board material | FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflon |
Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, r, Hard gold, Flash gold, OSP… |
Silk screen colour | White / Black / Yellow |
Solder mask colour | Green / Blue / Red / Black / Yellow / White |
Description | Technology & Capabilities | ||||||||
1. Product Range | Rigid PCBs from 2- 24 layers, HDI; Aluminium base | ||||||||
2. Min. Board Thickness | 2 layer | 4 layer | 6 layer | 8 layer | 10 layer | ||||
min. 0.2 mm | 0.4 mm | 1 mm | 1.2 mm | 1.5 mm | |||||
12 & 14 layer | 16 layer | 18 layer | 20 layer | 22 & 24 layer | |||||
1.6 mm | 1.7 mm | 1.8 mm | 2.2 mm | 2.6 mm | |||||
3. Max. Board Size | 610 x 1200 mm | ||||||||
4. Base Material | FR-4 Glass Epoxy laminate, Aluminium base, RCC | ||||||||
5. Surface Finish Treatment | Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic) | ||||||||
6. Major Laminate | King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others. | ||||||||
7. Via Holes | Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH | ||||||||
8. Copper Foil Thickness | 18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz) 18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz) | ||||||||
9. Min. Via Size and Type | Dia. 0.15mm (Finished). Aspect Ratiao = 12; HDI holes (<0.10mm) | ||||||||
10. Min. Line Width & Spacing | 0.75 mm/ 0.10mm ( 3mil/ 4mil) | ||||||||
11. Min Via Hole Size & Pad | Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI<0.10mm via | ||||||||
12. Impedance I Control Tol. | +/- 10% ( min. +/- 7 Ohm) | ||||||||
13. Solder Mask | Liquid Photo- Image (LPI) | ||||||||
14. Profiling | CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering | ||||||||
15. Capacity | 100 k㎡ output monthly |
Item | Capability |
Base material | FR4,High-TG FR4,CEM3,aluminum, High Frequencey frequency(Rogers,Taconic,Aron,PTFE,F4B) |
Layers | 1-4 Layers(Alunimum), 1-32 layers(FR4) |
Copper Thickness | 0.5oz, 1oz, 2oz, 3oz,4oz |
Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm |
Board Thickness | 0.4mm - 4.0mm |
Thickness Tolerance | +/-10% |
Aluminum Machining | Drilling, Tapping, Milling, Routing, Die-Punching, Break-off tab available |
Min Hole | 0.2 mm |
Min Track Width | 0.2mm (8mil) |
Min Track Gap | 0.2mm (8mil) |
Min SMD Pad Pitch | 0.2mm (8mil) |
Surface Finishing | HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP |
Solder Mask Color | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
Legend Color | Black, White etc |
Assembly Types | Surface mount Thro-hole Mixed technology (SMT & Thru-hole) Single or double sided placement Conformal coating Shield cover assembly for EMI emission control |
Parts Procurement | Full Turnkey Partial Turnkey Kitted/Consigned |
Component types | SMT 01005 or larger BGA 0.4mm pitch, POP (Package on Package) WLCSP 0.35mm pitch Hard metric connectors Cable & wire |
SMT Parts Presentation | Bulk Cut tape Partial reel Reel Tube Tray |
Stencils | Laser-cut stainless steel |
Other Techniques | Free DFM Review Box Build Assembly 100% AOI test and X-ray test for BGA IC programming Components cost-down Function test as custom Protection technology |
Sample Lead time | Mass production lead time | |||
Single sided PCB | 1~3 days | 4~7 days | ||
Double sided PCB | 2~5 days | 7~10 days | ||
Multilayer PCB | 7~8 days | 10~15 days | ||
PCB Assembly | 8~15 days | 2~4 weeks | ||
Delivery time | 3-7 days | 3-7 days | ||
Package: Anti-static Package with carton |