Layers | 1-58 layers |
Board material | FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflon |
Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, r, Hard gold, Flash gold, OSP… |
Silk screen colour | White / Black / Yellow |
Solder mask colour | Green / Blue / Red / Black / Yellow / White |
Item | Capability |
Base Material | FE-4/High TG FR-4/Lead Free Materials (ROHS Compliant)/Halogen Free Material/CEM-3/ CEM-1/PTFE/GOGERS/ARLON/TACONIC |
Layers | 1-28 |
Finised Inner/ Outter Copper Thickness | 1-6OZ |
Finised Board Thickness | 0.2-7.0mm |
Tolerance: Board Thickness ≤1.0mm: +/-0.1mm 1<Board Thickness≤2.0mm: +/-10% Board Thickness>2.0mm: +/-8% | |
Max Panel SIze | ≤2 sides PCB: 600*1500mm; Multilayer PCB:500*1200mm |
Min Cinductor Line Wideth/Spacing | Inner Layers: ≥ 3/3mil Outer Layers: 3.5/3.5mil |
Min Hole Size | Mechanical Hold: 0.15mm; Laser Hole: 0.1mm; Drilling Precision: First drikking: 1mil, Second drilling: 4mil |
Warpage | Board Thickness ≤0.79mm: β≤1.0% 0.80≤Board Thickness≤2.4mm: β≤0.7% Board Thickness ≤2.5mm: β≤0.5% |
Controlled Impedance | +/-5% |
Aspect Ratio | 15:01 |
Min Welding Ring | 4mil |
Min Solder Mask Bridge | ≥0.08 |
Plugging Vias Capbility | 0.2-0.8mm |
Hole Tolerance | PTH: +/-3mil; NPTH: +/-2mil |
Outline Profile | Rout/V-cut/Bridge/Stamp Hole |
Surface Treatment | OSP:0.5-0.5um HASL:2-40um Lead free Hasl:2-40um ENIG:Au 1-10U" ENEPIG:PB 2-5U""/Au 1-8U'' Immersion Tin:0.8-1.2um Immersion silver:0.1-1.2um Peelable Blue Mask Carbon Ink Gold plating:Au 1-150U' |
E-testing Pass Percent | 97% Pass For The First Time,+/-2%(tolerance) FQC-Physical Lab:Reliability Tests |
Certificate | ROHS, ISO9001:2015, IS013484:2016, IPC3 Staandard |