Description | Technology & Capabilities | ||||||||
1. Product Range | Rigid PCBs from 2- 24 layers, HDI; Aluminium base | ||||||||
2. Min. Board Thickness | 2 layer | 4 layer | 6 layer | 8 layer | 10 layer | ||||
min. 0.2 mm | 0.4 mm | 1 mm | 1.2 mm | 1.5 mm | |||||
12 & 14 layer | 16 layer | 18 layer | 20 layer | 22 & 24 layer | |||||
1.6 mm | 1.7 mm | 1.8 mm | 2.2 mm | 2.6 mm | |||||
3. Max. Board Size | 610 x 1200 mm | ||||||||
4. Base Material | FR-4 Glass Epoxy laminate, Aluminium base, RCC | ||||||||
5. Surface Finish Treatment | Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic) | ||||||||
6. Major Laminate | King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others. | ||||||||
7. Via Holes | Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH | ||||||||
8. Copper Foil Thickness | 18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz) 18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz) | ||||||||
9. Min. Via Size and Type | Dia. 0.15mm (Finished). Aspect Ratiao = 12; HDI holes (<0.10mm) | ||||||||
10. Min. Line Width & Spacing | 0.75 mm/ 0.10mm ( 3mil/ 4mil) | ||||||||
11. Min Via Hole Size & Pad | Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI<0.10mm via | ||||||||
12. Impedance I Control Tol. | +/- 10% ( min. +/- 7 Ohm) | ||||||||
13. Solder Mask | Liquid Photo- Image (LPI) | ||||||||
14. Profiling | CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering | ||||||||
15. Capacity | 100 k㎡ output monthly |